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Programme

10 March, 2010  
EVG Technology Day
Kazimierzowski Palace, Krakowskie Przedmiescie 26/28
09:00 - 09:10 am Opening Address
09:10 - 09:40 am IET activity profile
Maciej Bugajski, Krzysztof Domanski
09:40 - 09:55 am EVG corporate profile
Gerald Silberer
09:55 - 10:10 am F&K Delvotec corporate profile
Stefan Berger
10:10 - 10:40 am Coffee Break
10:40 - 11:50 am Bonding technology
Peter Hangweier (Product Manager, EVG)
11:50 am - 01:00 pm 3D integration, thin wafer handling, temporary bonding and debonding     
Josef Meiler (Regional Sales Director Europe, EVG)
01:00 - 02:00 pm Lunch
02:00 - 03:05 pm Automatic bonding and automatic testing - all in one machine
Josef Sedlmair (Coordinator Sales & Marketing International, F&K Delvotec)
03:05 - 03:35 pm Coffee Break
03:35 - 04:40 pm Advanced lithography and UV-exposure
Alois Malzer (Product Manager, EVG)
04:40 - 05:45 pm Nano-imprint lithography
Gerald Kreindl (Product Manager, EVG)
05:45 am - Closing Address

11 March, 2010  
F&K Delvotec Wire Bonder demonstration
Institute of Electron Technology - Laboratory of Technology of Semiconductor Structures
Al. Lotnikow 32/46, Bldg/Room: VII/111
09:00 - 12:00 am Wire Bonder 56xx demonstration