Programme
10 March, 2010 | |
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EVG Technology Day Kazimierzowski Palace, Krakowskie Przedmiescie 26/28 | |
09:00 - 09:10 am | Opening Address |
09:10 - 09:40 am | IET activity profile Maciej Bugajski, Krzysztof Domanski |
09:40 - 09:55 am | EVG corporate profile Gerald Silberer |
09:55 - 10:10 am | F&K Delvotec corporate profile Stefan Berger |
10:10 - 10:40 am | Coffee Break |
10:40 - 11:50 am | Bonding technology Peter Hangweier (Product Manager, EVG) |
11:50 am - 01:00 pm | 3D integration, thin wafer handling, temporary bonding and debonding Josef Meiler (Regional Sales Director Europe, EVG) |
01:00 - 02:00 pm | Lunch |
02:00 - 03:05 pm | Automatic bonding and automatic testing - all in one machine Josef Sedlmair (Coordinator Sales & Marketing International, F&K Delvotec) |
03:05 - 03:35 pm | Coffee Break |
03:35 - 04:40 pm | Advanced lithography and UV-exposure Alois Malzer (Product Manager, EVG) |
04:40 - 05:45 pm | Nano-imprint lithography Gerald Kreindl (Product Manager, EVG) |
05:45 am - | Closing Address |
11 March, 2010 | |
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F&K Delvotec Wire Bonder demonstration Institute of Electron Technology - Laboratory of Technology of Semiconductor Structures Al. Lotnikow 32/46, Bldg/Room: VII/111 | |
09:00 - 12:00 am | Wire Bonder 56xx demonstration |