1st Seminar

With a history deeply rooted in enabling R&D work at the university and research institute level, EV GROUP (EVG) is focused on providing advanced wafer-processing solutions to address next-generation semiconductor, MEMS and nanotechnology manufacturing needs. The company offers a broad portfolio wafer bonding, lithography, alignment, and inspection equipment for R&D through to high-volume manufacturing. With state-of-the-art application labs and clean room facilities at its headquarters in Austria, as well as in the U.S. and Japan, EVG delivers superior process expertise and support to its growing global customer base.

F&K DELVOTEC has been an active force in the wire bonding technology from its very beginning, more than 25 years ago. These many years of experience and the excellent training of our staff have resulted in our standing as the undisputed technology leader for deskopt bonding equipment in the entire world market. F&K DELVOTEC Semiconductor offers a worldwide unique 5 in 1 platform for wire bonding and even testing called DESKTOP MICRO FACTORY 56xx.